Jing Sheng Electromechanical, Kaishitong and others deliver new products, accelerating the large-scale application and upgrade of domestic semiconductor equipment
Release time: 2025-06-23
As the core support of the semiconductor industry chain, semiconductor equipment runs through the entire process of wafer manufacturing and packaging testing, including front-end manufacturing equipment such as lithography machines, etching machines, thin film deposition equipment, CMP equipment, cleaning equipment, ion implanters, and back-end packaging and testing equipment such as dicing machines, die attach machines, die bonding machines, wire bonding machines, trim and form machines, sorters, testers, and probe stations. Currently, the development level of semiconductor equipment plays a key role in a country or region's competitiveness and independent controllability in the semiconductor industry. China, as the world's largest semiconductor market, is continuously accelerating the upgrade of industry applications and scale expansion. Recently, several domestic semiconductor equipment manufacturers have made new progress: Qiusichuangxin, a subsidiary of Jing Sheng Mechanical & Electrical, successfully delivered a 12-inch atmospheric pressure silicon epitaxy system; Kaisitong, under Wanye Enterprise, delivered its first low-energy high-current ion implanter to a new customer in the sensor industry; Jiangsu Botao successfully shipped its first commercial CVD semiconductor equipment; Sucos Semiconductor's high-performance TGV electroplating equipment successfully passed factory acceptance testing...
As the core support of the semiconductor industry chain, semiconductor equipment runs through the entire process of wafer manufacturing and packaging testing, including front-end manufacturing equipment such as lithography machines, etching machines, thin film deposition equipment, CMP equipment, cleaning equipment, ion implanters, and back-end packaging and testing equipment such as dicing machines, die attach machines, die bonders, wire bonders, trim and form machines, sorters, testers, and probe stations.
Currently, the development level of semiconductor equipment plays a key role in a country or region's competitiveness and independent controllability in the semiconductor industry. As the world's largest semiconductor market, China is continuously accelerating the upgrade of industry applications and scale expansion.
Recently, several domestic semiconductor equipment manufacturers have made new progress: Qiusichuangxin, a subsidiary of Jinggong Electromechanical, successfully delivered a 12-inch atmospheric pressure silicon epitaxy device; Kaisitong, under Wanye Enterprise, delivered the first low-energy high-current ion implanter to a new customer in the sensor industry; Jiangsu Botao successfully shipped its first commercial CVD semiconductor equipment; Sukos Semiconductor's high-performance TGV electroplating equipment successfully passed factory acceptance testing...
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